Improve the quality of life through

Technology Innovation

We firmly believe that the future will be an interconnected world. SiPTORY is committed to working in an open partnership with our clients. By continuously exploring new technologies and making persistent efforts, we aim to contribute to the creation of a better life for humanity.

Whether it's for consumer, industrial, communication, or AI applications, we can meet your needs.

Innovative technology, efficient integration, user-first, safe and reliable, comprehensive support, driving your future!

PLP Product Line (Panel-Level Packaging)

Establishment of a leading high-density large panel-level fan-out packaging production line in China with independent intellectual property rights; Customisable leadless package shapes (DFN, QFN series package shapes); Main product applications: TVS/SBD/MOSFET/GaN/PMIC/DC-DC power chips and modules.

Expenses Screenshot

Packaging Substrate Product Line

Advanced packaging processes with independent intellectual property rights; Establishment of a leading high-density large panel-level fan-out packaging production line in China; Mass production capability of high-density large panel-level fan-out packaging processes.